Culture · 05/09/2025

This article provides an in-depth analysis of the key steps in traditional chip packaging processes, including wafer thinning, dicing, die bonding, wire bonding, and molding. It emphasizes the critical importance of each stage in enhancing chip performance and reliability.

Taxation · 08/07/2025

This article discusses the process of electronically submitting the Injured Spouse Allocation (Form 8379), which safeguards personal tax refund rights in a joint tax filing when the spouse has debts. It provides information on submission methods, processing times, and important considerations to help taxpayers effectively address related tax issues.